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Non-contact transport device×ソーラーリサーチ研究所 - List of Manufacturers, Suppliers, Companies and Products

Non-contact transport device Product List

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Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.

  • Other semiconductor manufacturing equipment
  • Other environmental equipment
  • Packaging materials

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Wafer chip, microlens, high-temperature wafer, non-contact transport device for micro-objects.

Wafer chip, microlens, high-temperature wafer, non-contact transport device for micro-objects.

Bernoulli chuck for non-contact transport of wafer chips, high-temperature wafers, lenses, and micro-objects.

The Bernoulli Chuck "Non-contact Transport Device for Microscopic Objects" has adopted a new vertical gas jet method. The vertical gas jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing the friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional models. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption. The "Non-contact Transport Device for Microscopic Objects" suspends and transports the workpiece in a non-contact state, floating in the air by ejecting air towards the substrate.

  • Other semiconductor manufacturing equipment
  • Other conveying machines
  • CVD Equipment

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Ultra-thin wafer non-contact transport device

Ultra-thin wafer non-contact transport device

Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.

TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.

  • Other semiconductor manufacturing equipment
  • Wafer
  • Semiconductor inspection/test equipment

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Wafer chip non-contact transport device

Wafer chip non-contact transport device

Transporting micro wafer chips and micro lenses non-contact.

It is non-contact. It is possible to transport small workpieces non-contact. There are no scratches or dirt attached. There is no damage.

  • Other semiconductor manufacturing equipment
  • Other physicochemical equipment

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10G glass substrate non-contact transport device

10G glass substrate non-contact transport device

10G glass substrate non-contact transport device

A non-contact transport device that holds and conveys workpieces in a suspended manner by ejecting gas. It employs a new mechanism for the gas ejection system, with the air ejection outlet positioned at a small angle relative to the workpiece. There is no deceleration of airflow velocity caused by friction losses due to wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it is adopted for the non-contact transport of large workpieces with high loads, particularly for the eighth generation large glass substrates (2200mm x 2200mm) used in LCDs, which had previously been avoided due to air consumption issues.

  • Other semiconductor manufacturing equipment
  • Other conveying machines
  • Transport and handling robots

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Non-contact transfer device "Float Chuck WLNA Type"

Non-contact transfer device "Float Chuck WLNA Type"

Grip and transport FPC, through-hole boards, films, and breathable non-woven fabrics without causing damage.

It grips, chucks, and transports flexible materials such as film, amorphous solar cells, paper, green sheets, non-woven fabrics, breathable materials, foams, and soft bodies. By blowing air towards the workpiece, it generates negative pressure through the Bernoulli effect, allowing it to chuck, grip, transport, stack, and handle the workpiece in a non-contact state.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Other packaging machines

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Non-contact transport device for sapphire substrate wafers "Float Chuck WAS" type

Non-contact transport device for sapphire substrate wafers "Float Chuck WAS" type

A Bernoulli chuck equipped with an exhaust recovery mechanism that reduces exhaust to the clean room, suitable for use in a clean room with a positioning mechanism.

1. Exhaust Recovery Mechanism: The cleanroom-compatible Bernoulli chuck "Float Chuck WAS type" is composed of an operating surface facing the wafer being held, a cushion chamber provided at the center of the operating surface, a nozzle located at the center of the cushion chamber, and a hood around the outer periphery of the operating surface. The high-speed air flow ejected from the nozzle flows into the gap between the operating surface and the wafer without contacting the walls of the cushion chamber or the wafer. The amount of negative pressure generated by the ejector effect in the cushion chamber also increases, allowing for efficient negative pressure generation. The exhaust air that passes through the gap between the operating surface and the wafer is captured by the surrounding hood and is drawn out through the exhaust port to a designated location. As a result, the high-speed air jet rarely flows into the cleanroom, preventing the discharge of debris and the lifting of dust. 2. Positioning Mechanism: The guide attached to the "Float Chuck WAS type" has a shape at the bottom end that contacts the outer peripheral touchable part of the held wafer, which regulates the free movement of the wafer. Therefore, positioning is possible even though the wafer is held non-contact.

  • Other semiconductor manufacturing equipment

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Non-contact transport device for compound semiconductor wafers "SAG (InP) type"

Non-contact transport device for compound semiconductor wafers "SAG (InP) type"

The compound semiconductor wafers (GaAs, InP, GaP) are supplied through gas operation, and the wafers are non-contact suctioned and detached at a specified position.

◎Features 1. Non-contact transport of wafers at high temperatures of 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers

  • Evaporation Equipment
  • Other physicochemical equipment
  • Wafer

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VGFS Non-contact Transport Device "Float Chuck SAC Type"

VGFS Non-contact Transport Device "Float Chuck SAC Type"

Adopting the gas vertical jet flow method (VGFS), the Bernoulli chuck "Float Chuck SAC type" series reduces friction loss in the gas flow.

The "Float Chuck SAC Type" series, which adopts the gas vertical jet flow system (VGFS) and reduces friction loss in the gas flow, has newly implemented this gas vertical jet flow method. The gas vertical jet flow method vertically jets the gas flow ejected from the nozzle into the cushion chamber, reducing friction loss in the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption.

  • Other semiconductor manufacturing equipment
  • Other machine elements
  • Transport and handling robots

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Non-contact transport device for green sheets "Float Chuck SAG type"

Non-contact transport device for green sheets "Float Chuck SAG type"

Transporting green sheets by air.

The non-contact transport device for ceramic green sheets, "Float Chuck SAG Type," holds and transports ceramic green sheets in a non-contact manner by blowing air through gas. The "Float Chuck SAG Type" is equipped with a nozzle that prevents high-speed air flow from directly colliding with the green sheet, thereby protecting the thin and fragile green sheets, which are 120μm thick, from damage and breakage due to the high-speed air flow. Additionally, the "Float Chuck SAG Type" uses a small amount of air, making it efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets of 120μm thickness. 4. Can transport ceramic green sheets without bending them. 5. Low air consumption. 6. Does not pollute the environment.

  • Other conveying machines
  • Circuit board processing machine
  • Pneumatic Equipment

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Non-contact transport device of the Solar Research Institute: Float Chuck SAC type

Non-contact transport device of the Solar Research Institute: Float Chuck SAC type

Custom-made vertical gas jet non-contact transport device "Float Chuck SAC Type"

We will manufacture a custom-made "Bernoulli chuck - non-contact transport device" that adopts a new mechanism of the Bernoulli chuck "Float Chuck SAC type," which has the Bernoulli effect, ejector effect, and Coanda effect. The new mechanism: The non-contact transport device "Float Chuck SAC type" has been enhanced with the Coanda effect to increase the ejector effect that generates suction power. It is a high-efficiency, low gas consumption non-contact transport device that combines the Bernoulli effect. This new method employs the "vertical jet airflow method" with the Bernoulli chuck for the non-contact transport device.

  • Other semiconductors
  • CVD Equipment
  • LCD display

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